We design high-reliability electronic schematics, multi-layer PCB layouts, and RF antenna circuits for IoT devices, automotive systems, and industrial controllers. Engineered in Indore, India for turnkey manufacturing.
From initial component selection and power architecture to multi-layer routing, DFM optimization, and automated testing jigs.
2-layer to 6-layer HDI boards with high-speed differential pairs (USB, Ethernet), signal return path ground planes, and strict power integrity routing.
Impedance-matched 50Ω transmission lines, coplanar waveguides, and integrated PCB trace antennas for 4G LTE, GNSS/GPS, BLE, and Wi-Fi.
TVS surge diodes, reverse polarity protection, optocoupler electrical isolation, and automotive load dump suppression (ISO 7637-2).
Design for Manufacturability (DFM) and Assembly (DFA) audits. We optimize Bill of Materials (BOM) cost with active supply chain sourcing.
High-efficiency buck/boost regulators, low-quiescent LDOs, LiPo/LiFePO4 battery charge management, and Power-over-Ethernet (PoE) circuits.
Custom bed-of-nails testing fixtures equipped with pogo pins, voltage sensors, and automated flashing rigs for reliable mass SMT production.
Inspect the actual multi-layer circuit boards, antenna layouts, and power stages built for our production products.
Multi-layer control board hosting dual-core processor, flash memory, and peripheral drivers for Attendance One.
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Tuned 13.56MHz loop antenna and impedance matching stage for sub-second contactless badge recognition.
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Heavy-duty commercial vehicle board with J1939 CAN transceiver, ignition relays, and transient surge filters.
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Isolated DC-DC power supply board with PoE Ethernet PHY interface and transient protection stages.
View ProductDefining system block diagrams, power budgets, footprint dimensions, and verifying component stock availability.
Hierarchical schematic capture, DRC validation, RF impedance matching, thermal vias, and multi-layer ground planes.
Bare board fabrication, prototype assembly, oscilloscope signal integrity validation, and power rail stress testing.
Building functional pogo-pin test fixtures (ATE) and coordinating with SMT assembly lines for volume manufacturing.
Consult with our hardware engineers in Indore to review your component architecture, schematic drafts, or enclosure constraints.