SERVICE OVERVIEW // IOT_ENG_07

Hardware-to-Cloud
IoT Engineering
for Edge Intelligence

Custom PCB design, embedded firmware, sensor fusion, and scalable cloud backends. We architect complete IoT systems from prototype to production.

Architecture Review View Capabilities
PCB_ARCHITECTURE
Multi-layer PCB • Firmware • Cloud

Technical Capabilities

CAP_STACK_001
[ 01/05 ]
C

Firmware & Embedded C/C++

Low-latency, power-optimized firmware for ARM Cortex-M, RISC-V, and ESP32. Bare-metal programming with real-time constraints.

C • C++ • ARM
[ 02/05 ]
PCB Design

Custom Hardware & PCB

High-density PCB layout, signal integrity analysis, RF tuning, and design-for-manufacturing optimization.

KiCAD • EAGLE • DSP
[ 03/05 ]

Connectivity & Protocols

BLE, Zigbee, LoRaWAN, NB-IoT, and MQTT/AMQP bridges. Seamless cloud integration with AWS/Azure.

BLE • MQTT • LTE
[ 04/05 ]
Analytics

Sensor Fusion & Analytics

Multi-sensor data processing, Kalman filtering, and real-time anomaly detection at the edge.

DSP • ML • DATA
[ 05/05 ]
Node.js

Scalable Cloud & OTA

Production-grade backends (Node.js/Go), secure OTA update infrastructure, and real-time dashboards.

AWS • NODEJS • OTA

Hardware Precision Meets Software Scale

We don't ship prototypes. Every IoT device we engineer includes 5-year firmware support, secure OTA infrastructure, and telemetry designed for scale.

01

End-to-End Security

Hardware security modules (HSM), encrypted storage, and certificate pinning from sensor to dashboard.

02

Autonomous Edge Logic

Local decision-making with FreeRTOS/Zephyr eliminates cloud dependency and latency.

03

Differential OTA Updates

Minimal bandwidth overhead. Secure, staged rollouts with automatic rollback on failure.

99.95%
Uptime Tracked
<50ms
Edge Response
5 years
Support Included

IoT Development Pipeline

PROCESS_V3.2
01/DISCOVERY

Requirements & Feasibility

Hardware specs, power budget, connectivity needs assessment.

02/SCHEMATIC

Circuit Design

Schematic capture, BoM optimization, component selection.

03/PCB_LAYOUT

Board Layout

Multi-layer design, signal integrity, manufacturing review.

04/FIRMWARE

Embedded Software

Low-level drivers, application logic, RTOS integration.

05/CLOUD_BRIDGE

Backend Integration

Device provisioning, telemetry, OTA infrastructure.

06/PRODUCTION

Manufacturing Scale

Testing jigs, fleet provisioning, support handoff.

Frequently Asked

FAQ_IOT_001
What does end-to-end IoT development include?
We handle the entire stack: PCB design + fabrication support, embedded firmware (C/C++), wireless connectivity (BLE/MQTT/LTE), cloud backend provisioning, mobile app integration, and 5-year OTA support. One team, one architecture.
How long does IoT MVP development take?
Typical MVP: 12–20 weeks depending on hardware complexity. Simple connectivity projects (BLE only) can run 8–12 weeks. We provide detailed roadmaps after technical discovery.
Can you scale to production volumes?
Yes. Every project includes manufacturing support: testing jigs, automated provisioning, firmware release management, and field support. We've shipped 100k+ units across IoT products.
What if we have existing hardware that needs firmware?
We reverse-engineer schematics and firmware architecture, audit your firmware for bugs and optimization opportunities, and deliver a roadmap for migration or rewrite. Typical audit: 1–2 weeks.
[ Ready to Engineer ]

Ready to Build Your
Connected Product?

Connect with our architects to discuss hardware constraints, cloud strategy, and a realistic timeline for your IoT vision.

Architecture Review View Full Portfolio

100+ IoT products shipped • Hardware + firmware + cloud under one team